MECHANIC iBGA 12 Pro 10in1 Automatic Positioning Leak-proof Reballing Platform

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JOD 17.00

Availability:

In stock

SKU

MEC-IBGA12PRO

Details

10-in-1 Reballing Platform: Professional multi-zone platform designed for BGA Reballing, Tin Planting, stencil alignment, and precision smartphone chipset repair workflows.
Automatic Magnetic Positioning: Integrated magnetic positioning architecture helps align compatible steel stencils accurately over supported CPU and IC packages.
Stable Chip Positioning: Secure fixture structure helps reduce unwanted processor and stencil movement during Solder Paste application and controlled thermal Rework.
Leak-Proof Boundary Design: Raised boundary structure is designed to help retain Solder Paste within the working area and reduce unwanted paste overflow during printing.
Precision Solder Printing: Supports controlled Solder Paste placement and consistent BGA ball formation on compatible IC and processor layouts.
10-in-1 Multi-Zone Configuration: Multiple working zones provide broader compatibility for different supported chipset and BGA repair applications.
High-Density Construction: Manufactured from durable composite materials designed to maintain dimensional stability during repeated thermal repair procedures.
Heat-Resistant Structure: Material construction helps limit unwanted thermal expansion and deformation during controlled Reflow and Hot Air Rework.
Reduced Solder Bridging: Accurate stencil alignment and controlled paste distribution help reduce Micro-Bridging and irregular solder deposition when used correctly.
Professional Micro-Soldering: Suitable for CPU and IC Reballing, Tin Planting, Missing Pad repair support, stencil positioning, Solder Paste application, and advanced Logic Board servicing under a microscope.