MECHANIC Large Liquid Glue Remover for Motherboard & IC Cleaning

JOD 2.00

Availability:

In stock

SKU

MEC-LIQGLUEREMOVER-L

Large-Capacity Glue Remover: Professional liquid cleaning solution designed for high-volume smartphone motherboard, IC, and electronics repair.
Fast-Acting Formula: Helps penetrate and soften stubborn adhesive residues for easier controlled cleaning and scraping.
Black Glue Removal: Suitable for loosening black adhesive and Underfill residue surrounding ICs during advanced board-level repair.
OCA Residue Cleaning: Helps remove OCA adhesive residue during display refurbishment and precision electronics servicing.
UV Mask Cleaning: Suitable for controlled cleaning and removal of compatible UV Mask residues during PCB repair.
IC Reballing Preparation: Helps clean and prepare chip and motherboard surfaces before IC Reballing and component-level repair.
Precision PCB Cleaning: Designed for use around PCB circuits, copper traces, IC areas, and other sensitive repair zones when applied correctly.
Large Economical Bottle: Higher-volume packaging is practical for busy repair centers, laboratories, and workshops with frequent daily use.
Efficient Workshop Supply: Large-size format reduces the need for frequent replacement and supports continuous professional repair workflows.
Professional Repair Applications: Suitable for motherboard degumming, IC cleaning, Underfill removal, OCA residue cleaning, BGA preparation, and advanced smartphone repair.