NC800 Premium Compact Liquid Glue Remover Pen for Mobile IC & PCB Cleaning

JOD 4.00

Availability:

In stock

SKU

MEC-NC800

Precision Liquid Glue Remover: Designed for controlled adhesive removal during smartphone motherboard, IC, and PCB repair.
Fast-Acting Formula: Helps penetrate and soften stubborn adhesive residues for easier and more controlled cleaning.
Black Glue & Underfill Removal: Suitable for loosening black glue and Underfill residue surrounding ICs during advanced board-level repair.
OCA Residue Cleaning: Helps soften and remove OCA adhesive residue during display refurbishment and electronics maintenance.
UV Mask Cleaning: Suitable for controlled cleaning and removal of compatible UV Mask residues during PCB repair.
Precision Pen-Style Application: Compact applicator design allows targeted liquid placement around densely arranged components and confined repair areas.
PCB & IC Cleaning: Designed for detailed cleaning around copper traces, IC areas, circuits, and delicate electronic components when used properly.
IC Reballing Preparation: Helps clean and prepare chip and motherboard surfaces before IC Reballing and component-level repair.
Compact & Space-Saving Design: Small format is easy to handle, store, and keep accessible on professional repair workbenches.
Professional Repair Applications: Suitable for motherboard degumming, IC cleaning, Underfill removal, OCA cleaning, BGA preparation, and precision smartphone repair.