MECHANIC IPX-11 Series Heating Module Platform with 5Pcs Reballing Steel Stencils

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JOD 10.00

Availability:

In stock

SKU

MEC-IPX11

Details

iPhone X-11 Series Heating Platform: Professional motherboard heating module designed for controlled layer separation, thermal splitting, and BGA Rework on compatible iPhone Logic Boards from iPhone X through iPhone 11 Pro Max.
Double-Stacked PCB Support: Designed for compatible multi-layer Logic Boards requiring controlled heating during separation and rebuilding procedures.
Uniform Heat Distribution: High-density thermal core architecture supports balanced heat transfer across the working area and helps reduce concentrated thermal stress.
Controlled Layer Separation: Supports precise motherboard layer separation while helping reduce unwanted PCB deformation when used with proper repair techniques.
5 Reballing Steel Stencils: Includes five dedicated high-temperature-resistant steel stencils for compatible Reballing and motherboard repair applications.
Precision Stencil Alignment: Accurately machined stencil layouts support controlled positioning over compatible motherboard Pad arrays under a microscope.
Stable Component Positioning: The workstation structure helps reduce unwanted movement during Solder Paste application, alignment, and controlled thermal Rework.
Heat-Resistant Steel Construction: Stencils are designed to maintain dimensional stability during repeated Reflow and BGA repair procedures.
Cooling Structure: Integrated cooling layout supports controlled heat dissipation after thermal repair procedures.
Professional Logic Board Repair: Suitable for Middle-Layer Separation, BGA Reballing, Solder Paste application, Pad repair support, and advanced multi-layer iPhone motherboard servicing.