MECHANIC iTin Max Precision CPU Positioning & Reballing Tin Planting Platform

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JOD 25.00

Availability:

In stock

SKU

MEC-ITINMAX

Details

Precision CPU Reballing Platform: Professional platform designed for CPU positioning, BGA Reballing, Tin Planting, and precision smartphone chipset repair workflows.
Automatic Magnetic Alignment: Integrated magnetic positioning system helps align compatible steel stencils accurately over the processor package.
Stable CPU Positioning: Secure fixture structure helps reduce unwanted processor and stencil movement during Solder Paste application and thermal Rework.
Precision Tin Planting: Supports controlled Solder Paste printing and consistent BGA ball formation on compatible CPU and IC layouts.
High-Density Construction: Built from durable composite materials designed to maintain dimensional stability during controlled thermal repair procedures.
Heat-Resistant Design: Material structure is designed to withstand repeated Reflow and Hot Air Rework while helping limit unwanted thermal deformation.
Ventilation Channel Structure: Integrated ventilation channels support more balanced heat dissipation around the working area during controlled heating.
Reduced Solder Bridging: Accurate stencil positioning and controlled Solder Paste application help reduce unwanted Micro-Bridging during Reballing.
Pad Protection Support: Stable positioning and controlled thermal workflows help reduce excessive mechanical or thermal stress around delicate CPU Pads when used correctly.
Professional Micro-Soldering: Suitable for CPU Reballing, IC positioning, Tin Planting, Missing Pad repair support, Solder Paste application, and advanced Logic Board repair under a microscope.