MECHANIC Repairman Aegis iT3Pro Middle Layer Heating Module + 2Pcs Steel Mesh for iPhone 14 Series

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JOD 12.00

Availability:

In stock

SKU

MEC-IT3PRO-IP14

Details

iPhone 14 Series Heating Kit: Professional Middle Layer heating module and steel mesh set designed for compatible iPhone 14 series Sandwich Board repair workflows.
Complete 3-Piece Set: Includes 1 Heating Module and 2 precision Steel Mesh sheets for motherboard separation, alignment, bonding, and Reballing procedures.
Middle Layer Repair Support: Designed for controlled separation and rebuilding of compatible double-stacked Logic Board structures.
Chrome-Plated Pure Copper Module: High-density pure copper heating module with chrome-plated construction supports efficient and balanced thermal transfer.
Uniform Heat Distribution: Designed to spread heat evenly across the supported board area and help reduce concentrated thermal stress during repair.
2 Precision Steel Mesh Sheets: Includes two heat-resistant steel mesh templates designed for accurate Middle Layer alignment and Solder Paste application.
Precision Board Alignment: Calibrated openings and positioning paths support accurate alignment of compatible iPhone 14 series motherboard layers under a microscope.
Heat-Resistant Structure: Steel mesh construction is designed to maintain stability during controlled Reflow and motherboard Rework procedures.
Reduced PCB Stress: Controlled positioning and balanced heating help reduce unnecessary board warping, Pad stress, and thermal exposure to nearby components when used correctly.
Professional Logic Board Repair: Suitable for Middle-Layer Separation, Bonding, Reballing, Solder Paste application, Sandwich Board rebuilding, and advanced iPhone motherboard servicing.