MECHANIC Aegis iT3-D Middle Layer Heating Module & Steel Stencils Kit for iPhone 12 / 12 Pro / 12 Pro Max

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JOD 15.00

Availability:

In stock

SKU

MEC-AEGISIT3D

Details

Heating Module & Stencil Kit: Professional motherboard repair set combining a middle-layer heating module with precision steel stencils for advanced iPhone Logic Board servicing.
iPhone 12 Series Compatibility: Designed for compatible iPhone 12, iPhone 12 Pro, and iPhone 12 Pro Max motherboard repair workflows.
Blue Copper Heating Module: Heavy-duty copper heating plate supports efficient thermal transfer during controlled motherboard splitting, desoldering, and Rework.
Uniform Heat Distribution: Engineered to spread heat across the supported board area, helping reduce concentrated thermal stress during double-stacked PCB repair.
Anti-Oxidation Coating: Protective surface treatment on the heating module helps reduce oxidation and supports durability during repeated professional use.
Precision Steel Stencils: Custom-fit micro-machined steel stencils support accurate solder paste placement and IC Reballing on compatible motherboard layouts.
Heat-Stable Stencil Structure: Steel stencil construction is designed to resist deformation during controlled high-temperature soldering and Reballing procedures.
Precision Board Matching: Module and stencil layouts follow supported iPhone 12 Series motherboard contours to improve positioning, alignment, and workflow control.
Double-Stacked PCB Repair: Suitable for board splitting, middle-layer servicing, IC Reballing, and advanced Micro-Soldering procedures.
Reduced Repair Risk: Stable board support and controlled thermal distribution help reduce the risk of board warping, lifted Pads, and nearby component damage when used correctly.