MECHANIC Aegis iT3-C Middle Layer Heating Module for iPhone 12 mini

Be the first to review this product

JOD 15.00

Availability:

In stock

SKU

MEC-AEGISIT3C

Details

Middle Layer Heating Module: Professional thermal module designed for motherboard splitting, desoldering, and double-stacked PCB repair on iPhone 12 mini.
iPhone 12 mini Compatibility: Precision-machined layout designed to match compatible iPhone 12 mini Logic Board contours.
High-Conductivity Copper Structure: Manufactured from a high-density copper alloy to support efficient thermal transfer during controlled motherboard repair.
Uniform Heat Distribution: Designed to spread heat across the supported board area, helping reduce concentrated thermal stress during separation and Rework.
Anti-Oxidation Coating: Protective surface treatment helps reduce oxidation and supports durability during repeated professional use.
Double-Stacked PCB Repair: Suitable for separating and servicing layered smartphone motherboards during advanced Micro-Soldering procedures.
Precision Board Matching: Machined structure follows the supported motherboard profile to improve positioning and thermal contact during repair.
Thermal Stress Control: Stable heat distribution helps reduce unnecessary Logic Board flexing and warping during compatible heating procedures.
Component Protection Support: Targeted thermal contact helps limit excessive localized heat exposure around sensitive IC and component areas when used correctly.
Professional Motherboard Rework: Ideal for middle-layer separation, board splitting, solder Reflow preparation, Logic Board restoration, and microscope-assisted repair.