MECHANIC Aegis iT3-B Middle Layer Heating Module for iPhone 11 / 11 Pro / 11 Pro Max

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JOD 15.00

Availability:

In stock

SKU

MEC-AEGISIT3B

Details

Middle Layer Heating Module: Professional thermal module designed for motherboard splitting, desoldering, and double-stacked PCB repair on iPhone 11, 11 Pro, and 11 Pro Max.
iPhone 11 Series Compatibility: Specially shaped for compatible iPhone 11, iPhone 11 Pro, and iPhone 11 Pro Max Logic Board layouts.
High-Conductivity Copper Structure: Manufactured from a high-density copper alloy to support efficient thermal transfer during controlled motherboard repair.
Uniform Heat Distribution: Designed to distribute heat across the supported board area, helping reduce concentrated thermal stress during separation and Rework.
Anti-Oxidation Coating: Protective surface treatment helps reduce oxidation and supports durability during repeated professional use.
Double-Stacked PCB Repair: Suitable for separating and servicing layered smartphone motherboards during advanced Micro-Soldering procedures.
Precision Board Matching: Machined layout follows supported iPhone 11 Series Logic Board contours to improve positioning and thermal contact.
Thermal Stress Control: Stable heat distribution helps reduce unnecessary board flexing and warping during compatible heating procedures.
Component Protection Support: Targeted thermal contact helps limit excessive localized heat exposure around nearby sensitive IC and component areas when used correctly.
Professional Motherboard Rework: Ideal for middle-layer separation, board splitting, solder Reflow preparation, Logic Board restoration, and microscope-assisted repair.