MECHANIC Aegis iT3-A Middle Layer Heating Module for iPhone X / XS / XS Max

Be the first to review this product

JOD 15.00

Availability:

In stock

SKU

MEC-AEGISIT3A

Details

Middle Layer Heating Module: Professional thermal module designed for motherboard splitting, desoldering, and double-stacked PCB repair on iPhone X, XS, and XS Max.
iPhone X Series Compatibility: Specially shaped for compatible iPhone X, iPhone XS, and iPhone XS Max Logic Board layouts.
High-Conductivity Copper Structure: Manufactured from a high-density copper alloy to support efficient heat transfer during controlled motherboard repair procedures.
Uniform Heat Distribution: Designed to spread thermal energy across the supported board area, helping reduce concentrated heat stress during separation and Rework.
Anti-Oxidation Coating: Protective surface treatment helps reduce oxidation and supports durability during repeated workshop use.
Double-Stacked PCB Repair: Suitable for separating and servicing layered smartphone motherboards during advanced Micro-Soldering procedures.
Precision Board Matching: Machined layout follows the supported Logic Board contours to improve positioning and thermal contact during repair.
Thermal Stress Control: Controlled heat distribution helps reduce the risk of unnecessary board flexing or warping during compatible heating procedures.
Component Protection Support: Targeted board support helps limit excessive thermal exposure to nearby sensitive IC and component areas when used correctly.
Professional Motherboard Rework: Ideal for middle-layer separation, board splitting, solder reflow preparation, Logic Board restoration, and microscope-assisted repair.