MECHANIC Aegis iT3-E Universal CPU, NAND & Dot Matrix Heating Module

Be the first to review this product

JOD 13.00

Availability:

In stock

SKU

MEC-AEGISIT3E

Details

Universal Chipset Heating Module: Professional preheating module designed for precision work on smartphone CPU, NAND storage IC, and Face ID Dot Matrix components.
Multi-Purpose Repair Support: Suitable for controlled desoldering, adhesive scraping, component servicing, and advanced chipset Rework.
High-Conductivity Copper Structure: Manufactured from a high-density copper alloy to support efficient and stable thermal transfer during repair.
Uniform Heat Distribution: Designed to spread heat across supported components, helping reduce concentrated thermal stress on delicate IC packages.
Anti-Oxidation Surface: Protective treatment helps reduce oxidation and supports durability during repeated professional use.
Multi-Zone Layout: Integrated working zones accommodate different supported chipset shapes and repair applications within one compact module.
Precision Component Nests: Dedicated recessed sections help hold compatible IC packages securely during heating, scraping, and Micro-Soldering procedures.
CPU & NAND Servicing: Supports advanced CPU and NAND Flash repair workflows requiring stable positioning and controlled preheating.
Dot Matrix Repair Support: Suitable for compatible Face ID Dot Matrix module servicing where precise thermal control and component positioning are required.
Reduced Repair Risk: Stable support and controlled heat distribution help reduce the risk of thermal shock, lifted Pads, trace damage, or unwanted component movement when used correctly.