MECHANIC S400 4-in-1 MultiFunctional Disassembling Blade Set

JOD 5.00

Availability:

In stock

SKU

MEC-S400

4-in-1 Blade Set: Includes four differently shaped precision blades designed for advanced smartphone and PCB repair applications.
IC Disassembly Support: Suitable for controlled separation and removal work around ICs, chipsets, SMD components, and densely arranged motherboard areas.
Black & White Glue Scraping: Helps scrape hardened black Underfill, white glue, resin, and structural adhesive around chips and PCB repair zones.
CPU Layer Separation: Specialized blade profiles support detailed CPU and multi-layer chip separation procedures.
Ultra-Thin Flexible Blades: Thin, flexible construction helps technicians access narrow gaps beneath components and adhesive layers.
Carbon-Alloy Steel: Manufactured from durable carbon-alloy steel for strength, flexibility, and reliable professional use.
Heat-Treated Construction: Thermal treatment improves blade durability and resistance to deformation during demanding repair tasks.
Heat-Resistant Performance: Designed to maintain practical performance during repair procedures involving controlled hot-air exposure.
Precision Blade Edges: Micro-finished edges support accurate scraping, separation, and component lifting around sensitive PCB areas when used carefully.
Anti-Slip Metal Handle: Heavy-duty metal chuck handle provides secure blade locking, balanced handling, and improved control during precision repair.