MECHANIC S300 3-in-1 MultiFunctional Disassembling Blade Set

- 3-in-1 Blade Set: Includes three differently shaped precision blades designed for advanced smartphone and PCB repair applications. - IC Disassembly Support: Suitable for controlled separation and removal work around ICs, chipsets, and densely arranged motherboard components. - Underfill Glue Scraping: Helps scrape hardened black Underfill, resin, and structural adhesive around chips and PCB repair areas. - CPU Layer Separation: Specialized thin blade profiles support detailed CPU and multi-layer chip separation procedures. - Ultra-Thin Flexible Blades: Thin and flexible construction allows technicians to access narrow gaps beneath components and adhesive layers. - Carbon-Alloy Steel: Blades are manufactured from durable carbon-alloy steel for strength, flexibility, and reliable workshop use. - Heat-Treated Construction: Refined thermal treatment improves blade durability and resistance to deformation during demanding repair tasks. - Heat-Resistant Performance: Designed to maintain practical performance during repair procedures involving controlled hot-air exposure. - Precision Blade Edges: Micro-finished edges provide accurate scraping, separation, and lifting around sensitive PCB areas when used carefully. - Anti-Slip Metal Handle: Heavy-duty metal chuck handle provides secure blade locking, balanced handling, and improved control during precision repair.