MECHANIC Mid-Level Steel Stencil for iPhone 14 / 14 Pro / 14 Pro Max Reballing

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JOD 3.00

Availability:

In stock

SKU

MEC-IP14MIDSTENCIL

Details

Professional Reballing Stencil: Precision steel stencil designed for chip-level motherboard repair and IC Reballing on iPhone 14, iPhone 14 Pro, and iPhone 14 Pro Max.
Multi-Model Compatibility: Combines layouts for supported iPhone 14 series Logic Boards, making it practical for professional repair workstations.
Stainless Steel Construction: Manufactured from heat-resistant stainless steel for durability during repeated soldering and Reballing procedures.
Anti-Bulging Structure: Reinforced construction is designed to help resist deformation and warping during controlled heating and soldering workflows.
Laser-Cut Precision: Precisely laser-cut openings support accurate positioning for compatible IC and motherboard Pad layouts.
Square Aperture Design: Micro-precise square openings support controlled solder paste placement and consistent solder ball formation.
Smooth Paste Release: Aperture structure helps promote uniform solder paste transfer and easier stencil separation after controlled heating.
Accurate Pad Alignment: Precision grid layout supports close alignment between stencil openings and compatible component Pads during Reballing.
Reduced Solder Bridging: Controlled aperture spacing and paste distribution help reduce the risk of unwanted Solder Bridging when used correctly.
Professional Micro-Soldering: Suitable for IC Reballing, chip-level repair, motherboard restoration, stencil-based solder paste application, and high-density iPhone Logic Board servicing.