MECHANIC IP17 Series Heating Module + 4Pcs Steel Stencils Set for iPhone 17 Series

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JOD 20.00

Availability:

In stock

SKU

MEC-IP17KIT4

Details

iPhone 17 Series Heating Kit: Professional heating module and stencil set designed for PCB layer separation and Reballing workflows on the iPhone 17 series.
Wide iPhone 17 Compatibility: Designed for iPhone 17, iPhone 17 Plus, iPhone 17 Pro, and iPhone 17 Pro Max motherboard repair.
Pure Brass Heating Module: High-density brass construction provides high thermal conductivity for efficient motherboard preheating and chip-level Rework.
Uniform Heat Distribution: Designed to spread heat consistently across compatible motherboard areas, helping reduce localized thermal spikes and concentrated thermal stress.
Multi-Layer PCB Support: Suitable for controlled heating during separation and servicing of compatible multi-layer iPhone Logic Boards.
4 Steel Stencils Included: Package includes four precision steel stencils designed for motherboard Reballing and solder paste application.
Laser-Cut Apertures: Precision-cut stencil openings support accurate alignment with compatible motherboard Pads and IC layouts.
Heat-Resistant Stencil Design: Steel construction is designed to maintain stability during controlled soldering and Hot Air Rework procedures.
Magnetic Alignment Support: Magnetic positioning system helps keep compatible stencils properly aligned and reduces unwanted movement during solder paste application.
Professional Micro-Soldering: Ideal for PCB separation, Reballing, Solder Paste application, IC servicing, Hot Air work, and advanced iPhone 17 series Logic Board repair.