MECHANIC iTin32 BGA Steel Reballing Stencil for Huawei Mate 30 Pro 4G

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JOD 4.00

Availability:

In stock

SKU

MEC-ITIN32

Details

Huawei Mate 30 Pro 4G BGA Stencil: Professional steel stencil designed for chip-level repair and BGA Reballing on compatible Huawei Mate 30 Pro 4G motherboards.
Kirin CPU Repair Support: Precision layout is designed around compatible Kirin CPU matrices and surrounding IC Pad arrays for advanced motherboard repair.
Heat-Resistant Steel: Manufactured from high-grade steel designed to maintain structural stability during controlled Reflow and Hot Air Rework.
Anti-Deformation Structure: Reinforced construction helps reduce stencil bending, bulging, and distortion during repeated thermal procedures.
Micro-Square Apertures: Precisely calibrated square openings support accurate alignment with compatible CPU and peripheral IC Pad layouts.
Precision Laser-Cut Design: Fine laser-cut apertures support controlled Solder Paste application and accurate component positioning.
Uniform Solder Paste Distribution: Aperture geometry helps distribute Solder Paste evenly across dense BGA connection arrays.
Reduced Micro-Bridging: Precise alignment and controlled paste application help reduce unwanted Solder Bridging during Reballing when used correctly.
Missing Pad Repair Support: Suitable for compatible Micro-Soldering workflows involving damaged or missing Pad matrices under microscope inspection.
Professional Motherboard Repair: Ideal for CPU Reballing, peripheral IC repair, Solder Paste application, Pad restoration support, and advanced Huawei motherboard servicing.