MECHANIC iTin 26 BGA Steel Reballing Stencil for iPhone XS / XS Max Motherboard

Be the first to review this product

JOD 4.00

Availability:

In stock

SKU

MEC-ITIN26

Details

iPhone XS Series BGA Stencil: Professional steel stencil designed for middle-layer bonding and IC Reballing workflows on compatible iPhone XS and iPhone XS Max Logic Boards.
Double-Stacked Logic Board Support: Designed for compatible multi-layer motherboard structures requiring accurate middle-layer alignment and controlled bonding.
Heat-Resistant Steel: Manufactured from high-grade steel designed to maintain structural stability during controlled Reflow and Hot Air Rework.
Anti-Deformation Structure: Reinforced construction helps reduce stencil bending, bulging, and distortion during repeated thermal procedures.
Micro-Square Apertures: Precisely calibrated square openings are designed around compatible middle-layer frames and peripheral IC Pad arrays.
Precision Laser-Cut Design: Fine laser-cut apertures support accurate positioning and controlled Solder Paste application.
Uniform Solder Paste Distribution: Aperture geometry helps distribute Solder Paste evenly across dense motherboard connection arrays.
Reduced Micro-Bridging: Accurate stencil alignment and controlled paste application help reduce unwanted Solder Bridging during Reballing when used correctly.
Missing Pad Repair Support: Suitable for compatible Micro-Soldering workflows involving damaged or missing Pad matrices under microscope inspection.
Professional Logic Board Repair: Ideal for Middle-Layer Bonding, BGA Reballing, Solder Paste application, Pad restoration support, and advanced iPhone motherboard servicing.