MECHANIC SAM Composite BGA Steel Stencil Set UFO 13-Port for Samsung

JOD 17.00

Availability:

In stock

SKU

MEC-SAMUFO13

13-Port BGA Stencil Set: Professional composite steel stencil designed to support multiple compatible Samsung motherboard and IC Reballing workflows.
Samsung Repair Applications: Suitable for compatible Samsung smartphone motherboard repair and chip-level Micro-Soldering procedures.
Multi-Position Layout: 13-port configuration provides multiple stencil sections for working with supported BGA and IC layouts from one repair template.
Composite Stencil Design: Integrates multiple repair patterns into a single practical stencil for professional repair-bench use.
Precision Steel Construction: Steel structure supports stable positioning during controlled BGA Reballing and Solder Paste application.
Accurate Aperture Layout: Precision openings help align Solder Paste with compatible IC Pad matrices during Reballing.
Controlled Paste Distribution: Stencil geometry supports consistent Solder Paste placement across supported BGA patterns.
Reduced Solder Bridging: Accurate positioning and controlled paste application help reduce unwanted Solder Bridging when used correctly.
Microscope Repair Support: Suitable for precision IC work, BGA Reballing, and detailed motherboard servicing under a microscope.
Professional Repair Use: Designed for trained technicians performing Samsung Logic Board, IC, BGA, and Micro-Soldering repair workflows.