MECHANIC iTin 171-IP 13 Pro MAX Middle Layer BGA Steel Reballing Stencil for iPhone 13 Pro Max

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JOD 5.00

Availability:

In stock

SKU

MEC-ITIN171IP13PROMAX

Details

iPhone 13 Pro Max BGA Stencil: Professional middle-layer steel stencil designed for Reballing and Logic Board repair workflows on compatible iPhone 13 Pro Max motherboards.
Dedicated Pro Max Layout: Designed around the specific middle-layer frame and peripheral Pad arrangement of compatible iPhone 13 Pro Max Logic Boards.
Double-Stacked Logic Board Support: Supports accurate middle-layer alignment and controlled bonding procedures on compatible multi-layer motherboard structures.
Heat-Resistant Steel: Manufactured from high-grade steel designed to maintain stability during controlled Reflow and Hot Air Rework.
Anti-Deformation Structure: Reinforced construction helps reduce stencil bending, bulging, and distortion during repeated thermal procedures.
Micro-Square Apertures: Precisely calibrated square openings support accurate alignment with compatible middle-layer and peripheral Pad arrays.
Precision Laser-Cut Design: Fine laser-cut apertures support controlled positioning and consistent Solder Paste application.
Uniform Solder Paste Distribution: Aperture geometry helps distribute Solder Paste evenly across dense motherboard connection arrays.
Reduced Micro-Bridging: Accurate stencil alignment and controlled paste application help reduce unwanted Solder Bridging during Reballing when used correctly.
Professional Logic Board Repair: Suitable for Middle-Layer Bonding, BGA Reballing, Missing Pad repair support, Solder Paste application, and advanced iPhone motherboard servicing.