MECHANIC XG-50 Liquid Solder Paste 183°C

JOD 4.00

Availability:

In stock

SKU

MEC-XG50

Professional Solder Paste: High-performance liquid solder paste designed for precision smartphone motherboard and electronics repair.
183°C Melting Point: Standard 183°C melting profile supports controlled soldering, Reflow, and Reballing procedures.
CPU Reballing Support: Suitable for detailed CPU Reballing and processor-level motherboard repair.
IC Soldering: Designed for IC replacement, soldering, and component-level servicing on compatible PCBs.
SMD & BGA Maintenance: Suitable for Micro-SMD work, BGA Reballing, and high-density component repair.
Consistent Alloy Texture: Homogeneous paste consistency supports smooth spreading and accurate application during stencil-based work.
Stencil Application: Designed to distribute evenly through compatible Reballing stencils without excessive clumping.
Reduced Solder Bridging: Controlled paste behavior helps reduce unwanted solder bridges when applied and heated correctly.
Reduced Solder Ball Formation: Proper application helps minimize unwanted solder-ball scattering during controlled heating.
Reliable Solder Joints: Supports bright, consistent, and electrically conductive solder joints for precision electronics repair.