MECHANIC UFO-06 0.12mm BGA Steel Reballing Stencil for iPhone XS / XS Max / XR

JOD 3.00

Availability:

In stock

SKU

MEC-UFO06

BGA Reballing Stencil: Professional steel stencil designed for chip-level repair and IC Reballing on compatible iPhone XS, iPhone XS Max, and iPhone XR Logic Boards.
0.12mm Precision Thickness: Calibrated 0.12mm thickness supports controlled Solder Paste application and accurate BGA Reballing workflows.
Heat-Resistant Steel: Manufactured from high-grade steel designed to maintain stability during controlled soldering and Hot Air Rework.
Anti-Deformation Structure: Reinforced construction helps reduce stencil bending, bulging, and warping during repeated thermal procedures.
Precision Laser-Cut Apertures: Fine micro-apertures support accurate alignment with compatible IC Pads and BGA layouts.
Consistent Solder Paste Distribution: Calibrated openings help distribute Solder Paste evenly for controlled solder-ball formation.
Clean Paste Release: Precision aperture design supports cleaner Solder Paste release during Reballing and Reflow procedures.
Reduced Solder Bridging: Accurate stencil geometry and controlled paste application help reduce unwanted Solder Bridging when used correctly.
Missing Pad Repair Support: Suitable for compatible Micro-Soldering workflows involving damaged or missing Pad arrays on Logic Boards.
Professional Microscope Repair: Ideal for IC Reballing, BGA repair, Solder Paste application, Pad restoration support, and precision iPhone motherboard servicing.