Professional Flux Paste: High-viscosity flux formulated for smartphone motherboard repair, SMD soldering, BGA Reballing, and advanced Micro-Soldering.
10CC Precision Syringe: Supplied in a 10CC syringe for controlled dispensing on ICs, solder pads, and densely populated PCB areas.
Halogen-Free Formula: Halogen-free formulation designed for professional electronics repair and precision soldering workflows.
No-Clean Chemistry: Designed to leave minimal residue after soldering, reducing the need for extensive post-solder cleaning in compatible applications.
High Thermal Stability: Maintains useful performance during controlled high-temperature soldering and rework procedures.
Excellent Wetting Performance: Supports smooth solder spreading and consistent joint formation across compatible pads and components.
Reduced Solder Bridging: Controlled flux behavior helps reduce unwanted solder bridges when proper soldering techniques are used.
Minimal Clear Residue: Formulated to leave a low-visibility residue suitable for detailed microscope-assisted motherboard repair.
SMD & BGA Repair: Suitable for IC replacement, BGA Reballing, SMD component work, and high-density PCB servicing.
Jump Wire & Flex Repair: Useful during microscopic jumper-wire soldering and compatible internal flex repair procedures.