MECHANIC R350 Desoldering Solder Wick BGA Pad Cleaning Braid

JOD 2.00

Availability:

In stock

SKU

MEC-R350

Professional Desoldering Wick: Designed for efficient solder removal, BGA pad cleaning, and precision smartphone PCB repair.
Oxygen-Free Copper Braid: Made from high-purity oxygen-free copper wires woven into a dense structure for effective solder absorption.
Pre-Coated No-Clean Flux: Treated with a non-corrosive No-Clean flux formula to improve solder flow and desoldering efficiency.
Strong Capillary Absorption: Quickly draws molten solder away from PCB pads when used with a heated soldering iron tip.
BGA Pad Cleaning: Suitable for removing residual solder from BGA pads and preparing clean surfaces for reballing and component replacement.
Uniform Heat Transfer: Copper braid helps distribute heat evenly across the working area during solder removal.
PCB Trace Protection: Designed to reduce the risk of damaging or lifting delicate copper traces when used correctly.
Anti-Static Protective Reel: Supplied in a protective dispenser reel for controlled, organized, and anti-tangle deployment.
Moisture-Resistant Storage: Protective reel helps reduce exposure to moisture and oxidation during storage.
Lead-Free Repair Applications: Suitable for lead-free soldering environments, micro-soldering, chip-level repair, and professional PCB maintenance.