Powerful Antioxidant Flux: Professional soldering flux formulated to help reduce oxidation during precision electronic and smartphone motherboard repair.
10CC Package: Supplied in a 10CC container for controlled use during CPU, IC, BGA, SMD, and PCB servicing.
Oxide Removal Support: Active formulation helps remove surface oxides during heating to improve solderability on compatible component surfaces.
Excellent Wetting Performance: Promotes smooth solder spreading across pads and component contacts during controlled soldering procedures.
Uniform Heat Transfer: Supports consistent thermal distribution during Reflow, Reballing, and component-level repair.
Smooth Tin Flow: Helps maintain controlled and uniform solder flow during delicate Micro-Soldering operations.
CPU Reballing Support: Suitable for precision CPU Reballing and processor-level motherboard repair.
IC, BGA & SMD Repair: Designed for IC soldering, BGA Reballing, SMD maintenance, and high-density PCB applications.
Reduced Residue: Formulated to help minimize carbonized residue when used with proper soldering temperatures and techniques.
Clean Solder Joint Formation: Helps produce bright, smooth, and consistent solder joints while reducing oxidation and corrosion-related concerns.