High-Conductivity OT Tip Series: Professional soldering iron tips designed for precision smartphone PCB repair and advanced chip-level micro-soldering.
High-Purity Copper Core: Built with an ultra-conductive copper core for efficient heat transfer and fast thermal response.
Multi-Layer Protective Plating: Reinforced electroplated layers help resist high-temperature oxidation, corrosion, and premature tip wear.
Rapid Thermal Recovery: Quickly restores working temperature during continuous soldering for stable and consistent performance.
Lead-Free & Anti-Static Applications: Optimized for modern lead-free soldering and anti-static repair environments involving sensitive PCBs and IC components.
OT-I Straight Needle: Ultra-fine straight tip suitable for dense SMD soldering, micro-capacitor positioning, and precision jumper-wire repair.
OT-SK Small Knife: Compact knife-shaped tip designed for removing residual solder from BGA pads and controlled work around adhesive residues.
OT-TI Curved / Slanted Needle: Angled fine tip provides improved access around taller components for difficult micro-soldering and jumper-wire connections.
Precision Microscope Repair: Suitable for BGA, SMD, PCB trace restoration, jumper-wire work, and detailed smartphone motherboard repair.