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MECHANIC iTin 170-IP 13 Pro Middle Layer BGA Steel Reballing Stencil for iPhone 13 Pro / 13 Pro Max
JOD 5.00
Availability:
In stock
SKU
MEC-ITIN170IP13PRO
- iPhone 13 Pro Series BGA Stencil: Professional middle-layer steel stencil designed for Reballing and Logic Board repair workflows on compatible iPhone 13 Pro and iPhone 13 Pro Max motherboards.
- Double-Stacked Logic Board Support: Designed for compatible multi-layer motherboard structures requiring accurate middle-layer alignment and controlled bonding.
- Heat-Resistant Steel: Manufactured from high-grade steel designed to maintain stability during controlled Reflow and Hot Air Rework.
- Anti-Deformation Structure: Reinforced construction helps reduce stencil bending, bulging, and distortion during repeated thermal procedures.
- Micro-Square Apertures: Precisely calibrated square openings support accurate alignment with compatible middle-layer frames and peripheral Pad arrays.
- Precision Laser-Cut Design: Fine laser-cut apertures support controlled positioning and consistent Solder Paste application.
- Uniform Solder Paste Distribution: Aperture geometry helps distribute Solder Paste evenly across dense motherboard connection arrays.
- Reduced Micro-Bridging: Accurate stencil alignment and controlled paste application help reduce unwanted Solder Bridging during Reballing when used correctly.
- Missing Pad Repair Support: Suitable for compatible Micro-Soldering workflows involving damaged or missing Pad matrices under microscope inspection.
- Professional Logic Board Repair: Suitable for Middle-Layer Bonding, BGA Reballing, Solder Paste application, Pad restoration support, and advanced iPhone motherboard servicing.
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