MECHANIC iTin-12 High Precision Magnetic Tinning Reballing Platform

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JOD 8.00

Availability:

In stock

SKU

MEC-ITIN12

Details

Magnetic Reballing Platform: Professional precision platform designed for IC tinning, Reballing, and chip-level smartphone motherboard repair.
Strong Magnetic Adsorption: Magnetic holding system keeps compatible steel stencils flat and firmly positioned during solder paste application and heating.
Improved Stencil Stability: Stable magnetic fixation helps reduce unwanted stencil movement, lifting, and misalignment during detailed Reballing procedures.
Precision Guide Pins: Integrated micro-precision alignment pins support accurate positioning between compatible stencil openings and IC Pads.
Controlled Solder Paste Application: Secure stencil positioning helps promote more consistent paste distribution across fine component layouts.
Heat-Resistant Composite Structure: Synthetic composite construction is designed to tolerate elevated temperatures encountered during soldering and Hot Air Rework.
Thermal Insulation Support: Platform materials help limit unnecessary heat transfer to surrounding working areas during controlled repair procedures.
Reduced Warping Risk: Stable support and heat-resistant construction help reduce deformation of compatible boards and stencils during thermal workflows.
PCB & IC Repair Support: Suitable for chip-level repair, IC Reballing, stencil-based tinning, motherboard servicing, and compatible layered PCB workflows.
Professional Micro-Soldering Use: Ideal for precision IC positioning, solder paste application, Reballing, Hot Air work, and advanced smartphone Logic Board repair.