MECHANIC IP15 Series Heating Module Platform with 3Pcs Reballing Steel Stencils

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JOD 10.00

Availability:

In stock

SKU

MEC-IP15KIT3

Details

iPhone 15 Series Heating Platform: Professional motherboard heating module designed for controlled layer separation, thermal splitting, and BGA Rework on compatible iPhone 15 series Logic Boards through iPhone 15 Pro Max.
Double-Stacked PCB Support: Designed for compatible multi-layer Logic Boards requiring controlled heating during separation, alignment, bonding, and rebuilding procedures.
Uniform Heat Distribution: High-density thermal core architecture helps distribute heat evenly across the working area and reduce concentrated thermal stress.
Controlled Layer Separation: Supports precise thermal splitting while helping reduce unwanted PCB warping when proper repair techniques are followed.
3 Reballing Steel Stencils: Includes three dedicated high-temperature-resistant steel stencils for compatible BGA Reballing and motherboard repair applications.
Precision Stencil Alignment: Accurately machined stencil layouts support controlled positioning over compatible motherboard Pad arrays under a microscope.
Stable Component Positioning: Platform and stencil structure help reduce unwanted component movement during Solder Paste application, alignment, and controlled thermal Rework.
Heat-Resistant Steel Construction: Steel stencils are designed to maintain dimensional stability during repeated Reflow and BGA repair procedures.
Integrated Cooling Structure: Cooling layout supports controlled heat dissipation following thermal repair procedures.
Professional Logic Board Repair: Suitable for Middle-Layer Separation, BGA Reballing, Solder Paste application, Pad repair support, and advanced multi-layer iPhone motherboard servicing.