MECHANIC IP14 Series Heating Module + 2Pcs Reballing Steel Stencils

JOD 10.00

Availability:

In stock

SKU

MEC-IP14KIT2

iPhone 14 Series Heating Kit: Professional heating module and Reballing stencil set designed for compatible iPhone 14 series Logic Board repair.
iPhone 14 Series Compatibility: Suitable for compatible iPhone 14, iPhone 14 Plus, iPhone 14 Pro, and iPhone 14 Pro Max motherboard workflows.
Uniform PCB Heating: High-density thermal structure is designed to distribute heat evenly across supported double-stacked PCB areas.
Layered Logic Board Separation: Supports controlled preheating and thermal separation during compatible multi-layer motherboard repair.
Reduced Thermal Stress: Balanced heating helps reduce concentrated hot spots and unnecessary thermal stress that may contribute to PCB warping.
2 Reballing Steel Stencils: Includes two precision steel stencils designed for compatible BGA and motherboard Reballing procedures.
Heat-Resistant Steel Construction: Stencils are designed to maintain stability during controlled soldering and Hot Air Rework.
Precision Alignment: Accurate stencil positioning supports alignment with compatible Pads and component layouts during Solder Paste application.
Pad Protection Support: Stable positioning and controlled heating help reduce excessive mechanical or thermal stress around delicate motherboard Pads when used correctly.
Professional Micro-Soldering: Suitable for PCB Preheating, Logic Board separation, BGA Rework, Reballing, Solder Paste application, and advanced iPhone motherboard servicing.