Multifunction Motherboard Fixture: Professional repair platform designed for iPhone Logic Board clamping, IC servicing, and precision hardware Rework.
Stable PCB Clamping: Secure fixture design helps hold compatible smartphone motherboards firmly during detailed soldering and component-level repair.
Dual-Axis Clamping System: Omni-directional dual-axis adjustment supports flexible positioning of different compatible PCB shapes and repair areas.
Heat-Resistant Structure: High-density composite construction is designed to tolerate elevated temperatures encountered during controlled Hot Air and soldering procedures.
Reduced Board Movement: Stable support helps minimize vibration and unwanted motherboard shifting during microscope-assisted repair.
Warping Control Support: Firm clamping helps reduce unnecessary board flexing and deformation during controlled thermal Rework.
Integrated Micro-Slots: Dedicated work areas support glue scraping, component access, CPU Reballing, and precision motherboard servicing.
CPU & NAND Repair Support: Suitable for advanced CPU Reballing, NAND Flash servicing, IC replacement, and high-density Logic Board repair.
Pad & Flex Protection Support: Controlled positioning helps reduce the risk of lifted Pads, trace damage, or accidental stress on nearby Flex components when used correctly.
Professional Workbench Use: Ideal for iPhone motherboard repair, Micro-Soldering, Hot Air Rework, adhesive removal, IC servicing, and microscope-based maintenance.