Professional Ultrasonic Cleaner: Designed for deep cleaning of smartphone motherboards, PCBs, IC areas, and micro-electronic components during advanced repair.
Ultrasonic Cavitation Technology: Generates high-frequency cleaning action that helps cleaning solution reach microscopic gaps and densely packed component areas.
Deep PCB Cleaning: Helps remove stubborn contamination from complex circuit boards and electronic assemblies.
Oxidation Removal Support: Suitable for cleaning oxidation and mineral deposits commonly associated with moisture and water-damaged electronics.
Flux Residue Cleaning: Helps loosen carbonized and stubborn flux residue left after soldering and board-level repair.
BGA & IC Area Cleaning: Ultrasonic action helps cleaning fluid penetrate beneath and around tightly arranged BGA and IC components.
Stainless Steel Tank: Durable stainless steel cleaning chamber designed for repeated professional workshop use.
Digital Control Panel: Intuitive controls allow precise adjustment of cleaning time and available operating settings.
LED Display: Clear digital display provides convenient monitoring of the selected cleaning parameters.
Professional Repair Application: Suitable for smartphone motherboard restoration, PCB maintenance, water-damage cleaning, micro-soldering workflows, and electronics service centers.