MECHANIC Hanjiang 3D-XS-M Pro 3D BGA Reballing Stencil Set for iPhone X / XS / XS Max

JOD 3.00

Availability:

In stock

SKU

MEC-3DXSMPRO

3D BGA Reballing Stencil Set: Professional stencil set designed for chip-level repair and Reballing workflows on iPhone X, iPhone XS, and iPhone XS Max Logic Boards.
3D Stepped Groove Design: Three-dimensional recessed structure helps position compatible chips accurately and maintain alignment during detailed Reballing procedures.
Self-Aligning Support: Structured grooves help reduce unwanted component movement while applying Solder Paste and working with controlled heat.
Heat-Resistant Steel: Manufactured from durable steel designed to maintain stability during soldering and Hot Air Rework.
Anti-Bulging Structure: Reinforced stencil construction helps reduce lifting, deformation, and warping during repeated thermal workflows.
Precision Square Apertures: Laser-cut square openings support consistent Solder Paste release and accurate BGA ball formation.
Reduced Solder Bridging: Precise aperture geometry and controlled paste application help reduce unwanted Solder Bridging during Reballing.
Middle-Layer Logic Board Repair: Suitable for compatible double-stacked board separation, alignment, bonding, and restoration procedures.
CPU & NAND Reballing Support: Designed to support precision CPU, NAND, and other compatible IC Reballing workflows under a microscope.
Professional Micro-Soldering: Ideal for BGA Reballing, Solder Paste application, Logic Board servicing, middle-layer repair, CPU/NAND work, and advanced iPhone motherboard maintenance.