MECHANIC GR300 CPU Chip Degumming Liquid

JOD 5.00

Availability:

In stock

SKU

MEC-GR300

Professional Chip Degumming Liquid: Designed for removing adhesive around CPUs, ICs, and microchips during smartphone motherboard repair.
Black Glue Removal: Helps soften stubborn black glue surrounding chips and sensitive PCB components.
Epoxy Resin Softening: Formulated to penetrate and loosen hardened epoxy and adhesive residue for easier removal.
Fast-Acting Formula: Works within minutes to help prepare adhesive for controlled scraping and cleaning.
CPU & IC Cleaning: Suitable for detailed cleaning around processors, ICs, BGA areas, and other motherboard components.
PCB-Safe Application: Designed for careful use around PCB traces and surrounding electronic components during professional repair.
Chip Desoldering Support: Helps technicians prepare glued chips before controlled removal and desoldering procedures.
IC Reballing Preparation: Useful for cleaning chip surfaces and surrounding areas before reballing and reinstallation.
Precision Motherboard Repair: Suitable for detailed board-level repair where controlled adhesive removal is required.
Professional Repair Use: Ideal for smartphone repair centers, electronics laboratories, and advanced chip-level maintenance.