Ultra-Fine Copper Jumper Wire: Professional repair wire designed for PCB trace restoration, broken pad reconstruction, and advanced Micro-Soldering.
0.02mm Ultra-Fine Diameter: Microscopic wire profile supports detailed routing through high-density PCB layouts, BGA areas, and compact CPU sections.
100-Meter Spool: Supplied as a 100M roll for repeated professional motherboard repair and circuit reconstruction work.
High-Purity Copper Core: Copper construction provides reliable electrical conductivity for precision jumper-wire and trace-repair applications.
Flexible Wire Structure: Fine construction supports controlled bending and routing around miniature components and narrow motherboard areas.
Trace & Pad Reconstruction: Suitable for rebuilding damaged PCB traces and restoring compatible broken pad connections.
BGA & CPU Repair Support: Fine diameter allows routing around or beneath compatible BGA packages and multi-layer CPU repair areas.
Solderable Insulation Coating: Protective coating is designed to respond to soldering heat, reducing the need for extensive manual scraping before soldering.
Reduced Bridging Risk: Insulated construction helps reduce unintended electrical contact between closely spaced conductors when routed and soldered correctly.
Professional Micro-Soldering Use: Ideal for Jump Wire work, PCB trace restoration, BGA repair, CPU servicing, and detailed smartphone logic board maintenance.