MECHANIC Curve Programmable Disassembly Heating Station for Screen & PCB Separation

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JOD 60.00

Availability:

In stock

SKU

MEC-CURVE

Details

Programmable Heating Station: Professional disassembly platform designed for curved screen separation, multi-layer PCB splitting, and precision component desoldering.
Thermal Curve Control: Programmable heating profiles allow technicians to manage controlled temperature progression for different repair workflows.
Curved Screen Separation: Suitable for controlled heating during compatible curved display disassembly and screen refurbishment procedures.
Multi-Layer PCB Splitting: Supports thermal separation of compatible double-stacked and multi-layer Logic Boards during advanced motherboard repair.
Uniform Heat Distribution: Heating platform is designed to spread thermal energy evenly across supported work areas, helping reduce concentrated thermal stress.
Real-Time Digital Control: Integrated digital interface supports active monitoring and adjustment during heating and disassembly procedures.
Multiple Heating Modes: Built-in operating profiles support different smartphone repair, screen separation, PCB Rework, and component desoldering tasks.
Thermal Stress Reduction: Controlled heating helps reduce sudden temperature changes that may contribute to display or Logic Board warping.
Precision Rework Support: Stable heating conditions help reduce unnecessary movement and mechanical stress on sensitive Pads, Traces, and nearby Flex components when used correctly.
Professional Hardware Restoration: Ideal for screen separation, PCB splitting, desoldering, thermal Rework, Logic Board servicing, and advanced smartphone disassembly.