MECHANIC CPG90 Beta CPU Solder Paste 50g 199°C

JOD 5.00

Availability:

In stock

SKU

MEC-CPG90

Beta CPU Solder Paste: Professional liquid solder paste developed for advanced Android smartphone CPU Reballing and precision component repair.
50g Professional Package: Supplied in a 50g container suitable for repeated CPU, BGA, and Micro-Soldering applications.
199°C Melting Point: Specialized high melting profile of 199°C supports controlled soldering and Reballing procedures requiring this temperature range.
Android CPU Reballing: Formulated specifically for compatible Android processor Reballing and chip-level motherboard servicing.
Micro-Component Tin Planting: Suitable for forming solder balls and applying solder to miniature component pads during precision repair.
Strong Alloy Performance: Formulated to support mechanically stable solder connections in processor and BGA repair applications.
Uniform Paste Texture: Consistent formulation supports smooth application through compatible Reballing stencils.
Reduced Clumping: Fine, homogeneous texture helps minimize uneven paste buildup during stencil application.
Reduced Solder Bridging: Controlled application helps reduce unwanted solder bridges between closely spaced pads.
Reliable Solder Ball Formation: Supports bright, consistent, and well-formed solder balls for CPU, BGA, and advanced motherboard repair.