C245 Fast-Heating Tip Series: Professional integrated soldering iron tips designed for precision smartphone motherboard repair and advanced micro-soldering.
Three Tip Profiles: Available in TI Ultra-Fine Straight Conical, TS Ultra-Fine Curved Conical, and SK Micro Knife Blade versions for different repair tasks.
2-Second Fast Heating: Direct thermal core cartridge design reaches the target operating temperature in approximately 2 seconds.
Fast Thermal Recovery: Rapid temperature recovery helps maintain consistent soldering performance during detailed board-level work.
High-Purity Copper Core: Built with a high-purity copper core for efficient heat transfer to the soldering point.
Multi-Layer Anti-Oxidation Plating: Reinforced protective plating helps resist oxidation and supports longer tip service life.
Precision Micro-Soldering: TI and TS fine tips are suitable for detailed solder joints, microscopic jumper wires, and high-density PCB work.
BGA Pad Cleaning: SK knife-style tip is suitable for working across small solder areas and clearing solder residue from BGA pads.
Microscope Repair Applications: Designed for motherboard repair, jumper-wire work, PCB restoration, and delicate flex-line soldering under magnification.