Black Glue Removing Liquid: Professional adhesive-removal solution designed for smartphone motherboard and chip-level repair workflows.
30ML Package: Supplied in a compact 30ML bottle suitable for controlled use during precision electronics servicing.
CPU Glue Removal: Helps soften and remove compatible black adhesive around CPU areas during motherboard repair and Rework.
HD Chip Applications: Suitable for controlled adhesive removal around compatible HD chips and surrounding repair areas.
Controlled Adhesive Softening: Formulated to help soften cured glue before mechanical cleaning or component servicing.
Motherboard Repair Support: Designed for technicians performing detailed smartphone Logic Board maintenance and component-level repair.
Chip-Level Rework: Useful during IC servicing, chip replacement, adhesive cleanup, and advanced PCB repair procedures.
Precision Application: Liquid format supports localized use around targeted components during detailed repair work.
Repair Workshop Use: Suitable for smartphone repair centers, electronics laboratories, and professional Micro-Soldering workstations.
Professional Handling: Intended for trained technicians following manufacturer instructions, suitable ventilation, and appropriate protective measures.