MECHANIC TI-08 3D Infrared Thermal Imaging Analyzer

Features:

• 3D Infrared Thermal Imaging Analyzer, professional motherboard testing equipment, so that your maintenance faster, faster and more accurate

• One-click fault quick check, quickly locate mainboard faults and support one-click leakage detection

• 3D thermal field release analysis visual display of temperature changes

• Antistatic base high-temperature resistant silicone aluminum alloy base plate

• Military-grade high-resolution infrared lens, no visible light camera, can clearly show the outline minimalist design, high performance, mechanical appearance, and even more impeccable cost performance

• 52000-point effective temperature measurement (192x256) full-frame infrared detection

• PC software independently developed, compatible with more than 90% of the computer systems on the market

• A quick check of leakage current, quickly locate temperature anomalies based on the real-time temperature and fine-tune the temperature range to troubleshoot faults

• When the temperature exceeds the set temperature, the image flashes a red box and sounds an alarm, the function can be used to track the highest temperature point on the screen and mark the temperature

• Special mode innovation for product evaluation and heat distribution analysis, 3D thermal field mode is more intuitive, and 2D thermal field area curve recording is more detailed

• According to different use scenarios switch different color swatches 5 different development color swatches

• For heat distribution design optimization, fault differentiation comparison verification region temperature curve comparison record, superposition comparison, and so on

• 360° fine-tuning new experience mechanical beauty, quickly adjust the lens direction/distance according to demand a stable structure/fast/convenient

• Prevent the lens from striking the motherboard under test when quickly adjusting the position, and limit the minimum focal length range

• High temperature resistance up to 500℃, prevents the maintenance of heat insulation pad carbonization, anti-static

Specification:

• Product model: Mechanic 3D Infrared Thermal Imaging Analyzer

• Product model: TI-08

• Product size: 285*220*172mm

• Packing size: 270*205*95mm

• Net weight: 1.3KG

• Gross weight: 1.75Kg

• Resolving power: 256 x192 pixels

• Temperature measurement distance: 30mm-150mm

• Device interface: USB Type-C

• Lens field of view angle: 56x42

• Image storage format: JPG

• Video storage format: MP4

Package includes:

• 1 x Infrared Thermal Imaging Analyzer