MECHANIC UFO 02 BGA Steel Reballing Stencil for iPhone 6S / 6S Plus

JOD 3.00

Availability:

In stock

SKU

MEC-UFO02

BGA Reballing Stencil: Professional steel stencil designed for chip-level repair and IC Reballing on compatible iPhone 6S and iPhone 6S Plus Logic Boards.
UFO Circular Design: Part of the MECHANIC UFO stencil series, featuring a circular format suitable for precision work under a microscope.
Heat-Resistant Steel: Manufactured from high-grade steel designed to maintain structural stability during controlled soldering and Hot Air Rework.
Anti-Deformation Structure: Reinforced construction helps reduce stencil bending, bulging, and warping during repeated thermal workflows.
Precision Laser-Cut Apertures: Micro-precision openings support accurate alignment with compatible IC Pads and BGA layouts.
Consistent Solder Paste Release: Calibrated apertures help distribute Solder Paste evenly for controlled solder-ball formation during Reballing.
Reduced Solder Bridging: Precise aperture geometry and controlled paste application help reduce unwanted Solder Bridging when used correctly.
Power IC Repair Support: Suitable for compatible power-management IC Reballing and chip-level motherboard servicing.
Baseband & Audio IC Support: Designed to support compatible Baseband IC, Audio IC, and other BGA component repair workflows.
Professional Micro-Soldering: Ideal for IC Reballing, Solder Paste application, BGA repair, Logic Board maintenance, and precision iPhone motherboard servicing.