MECHANIC 008 Professional Motherboard IC Chip Degumming Blade Set

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JOD 9.00

Availability:

In stock

SKU

MEC-008

Details

Professional Degumming Blade Set: Precision repair kit designed for Underfill epoxy removal, black glue scraping, IC servicing, and detailed smartphone motherboard maintenance.
Multiple Specialized Blade Profiles: Includes several micro-thin blades with different geometric shapes for accessing narrow spaces and complex PCB layouts.
High-Flexibility Spring Steel: Blades are manufactured from flexible spring steel to provide controlled movement while maintaining useful structural rigidity.
Underfill Epoxy Removal: Suitable for carefully scraping hardened Underfill and compatible epoxy residue around IC and CPU areas.
Black Glue Scraping: Fine blade profiles support controlled removal of black adhesive around motherboard components.
Slim Anti-Slip Handle: Lightweight handle with a non-slip surface provides improved control during microscope-assisted repair.
Acid-Resistant Construction: Blade material provides resistance to compatible acidic residues and workshop chemicals encountered during electronics servicing.
High Thermal Stability: Designed for controlled use around Hot Air and desoldering environments during advanced motherboard repair.
Tip Deformation Resistance: Spring steel construction helps the blades recover their shape and reduce permanent deformation during appropriate use.
Controlled PCB Repair: Smooth precision edges help reduce unwanted stress on copper pads, PCB coatings, nearby components, and internal flex cables when used correctly.