High-Precision Repair Blade Set: Professional blade kit designed for detailed smartphone PCB maintenance, IC servicing, adhesive removal, and component-level repair.
High-Carbon Steel Blades: Made from heat-treated high-carbon steel for durability, edge retention, and controlled precision during detailed repair procedures.
Ultra-Thin Flexible Profiles: Slim and flexible blade construction helps technicians access narrow spaces within high-density motherboard layouts.
Ergonomic Metal Handle: Lightweight anodized metal handle provides balanced handling and precise control during microscope-assisted repair.
Non-Slip Textured Grip: Textured surface improves grip and tactile control during delicate scraping and separation procedures.
Black Underfill Removal: Suitable for carefully scraping hardened black Underfill and compatible resin residue around IC components.
PCB Edge Cleaning: Multiple blade profiles support controlled cleaning and scraping around motherboard edges and densely arranged components.
OCA Adhesive Removal: Suitable for removing compatible OCA residue during display repair and refurbishment procedures.
Multi-Layer Board Separation Support: Thin blade profiles can assist with controlled separation work on compatible multi-layer motherboard structures.
Professional Micro-Repair Application: Ideal for IC preparation, PCB cleaning, glue removal, board separation, and detailed smartphone hardware repair.