MECHANIC Heat Air Curve Heating Program Disassembly Station

Features:

Cellphone motherboard repair intelligent delamination station, one key intelligent separation/bonding function, safe and reliable, will not cause tin explosion phenomenon

In just 60 seconds, the heating platform heats up quickly, in 180 seconds, it can easily complete layered tasks

The intelligent temperature control system and high-temperature protection function ensure that the motherboard will not be damaged during operation to provide users with a safe and efficient heating experience

The heating platform uses efficient heating elements and heat-conduction materials, ensuring rapid heating up in just 1 minute, with its 600W peak power input

The heating platform features a 2.5-inch HD display that clearly shows the real-time temperature, countdown, and three temperature memory storage to keep you on top of the heating status, easily respond to various work demands

Multifunction key stepless dial, multifunctional stepless dial rotary key, and multiple function definition settings make it easy with one click

• Temperature setting(Room temperature ~260°C): Rotate the button to adjust the temperature, click to switch the memory temperature, long press to heat up, and long press again to cool down

• Time setting(10 sec~990 sec): Double-click to enter the time setting, adjust the setting time through the knob double-click again, or wait 5-8 seconds to confirm

• Heat is generated during the working process and this heat needs to be dissipated through the heat dissipation hole

• Using maintenance technology, the blocking defect of a maintenance operation is further optimized, built for the motherboard, high temperature, and no blocking, making maintenance work more convenient

• Adopting an aluminum alloy and steel high-quality combination, not only the appearance is beautiful and generous, but it also has high hardness and excellent corrosion resistance

• The heating platform is designed for the full series of iPhone X-15 models, to ensure better compatibility with various models, more modules continue to develop

• Boot current fault data storage, current curve fault analysis can be checked, supports Bluetooth /WiFi wireless connection to PC applications, support remote cloud software upgrade

Package includes:

• 1 x Host

• 5 x Module

• 17 x Stencil

• 1 x Power Cable