MECHANIC GS2 Pad Repair Point Set

Product Features :-

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• The pads are reinforced with fixed pins and will never fall off.
• it adopts industrial-grade printed circuit board copper foil with a thickness of 30um.
• Good flatness, which can prevent pseudo soldering effectively caused by unevenness.?
• The BGA bonding surface has high saturation, stable electrical performance, good welding strength, and?
• it is not easy to drop off and unsoldering.?
• The connection joint with the circuit is firm, and can fixed the green oil (UV curing solder mask ink) well.
• it saves time and effort and no need to circle during jumping wire so the repair efficiency is relatively high.