MECHANIC 559 100G 20th Anniversary High Active Flux Paste

Features:
• High‑viscosity, no‑clean flux suitable for PCB, SMD, rework, and BGA reballing.

• The BGA solder paste combines premium alloyed powder with a resinous flux, preventing pale‑yellow residues and making board cleaning effortless.
• Ideal for cell‑phone PCBs, SMD components, and general electronics welding and soldering.
• Helps repair circuit boards while protecting delicate electronic components.
• Essential material for mobile‑phone mainboard refurbishment.

Package includes:

• 1 × Soldering Paste Flux